The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 1994
Filed:
Mar. 31, 1993
Wilbur T Layton, San Diego, CA (US);
Blanquita O Morange, San Diego, CA (US);
Angela M Torres, Vista, CA (US);
Unisys Corporation, Blue Bell, PA (US);
Abstract
An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as including a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed by and partially fills the microscopic voids of the compliant body. Due to the presence of the liquid metal alloy, the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein.