The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 1994
Filed:
Oct. 06, 1992
Dennis Brzezinski, Sunnyvale, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A multi-chip module having a conformal heat transfer interface to adapt to variations in the height and angle of integrated circuit chips and to achieve a thermal energy path between each chip and a heat sink. The conformal heat transfer interface includes a deformable metallic membrane and a liquid under pressure. The liquid has a high thermal conductivity and provides a pressure for deforming the metallic membrane to compensate for non-coplanarity of the chips. The module integrates the structural support, RF shielding, contamination-protection elements, and the heat-dissipating mechanism that are desired in the design of multi-chip modules. Double-sided cooling of the module significantly improves the thermal characteristics of a module, even in the absence of the conformal heat transfer interface.