The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 1994
Filed:
Oct. 07, 1991
Applicant:
Inventors:
Chun-Hua K Chuang, Brecksville, OH (US);
Raymond D Vannucci, Brooklyn, OH (US);
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08C / ; C08C / ;
U.S. Cl.
CPC ...
528353 ; 528125 ; 528126 ; 528128 ; 528172 ; 528173 ; 528174 ; 528176 ; 528188 ; 528220 ; 528229 ; 528350 ; 528351 ; 524600 ;
Abstract
Addition polyimide resins having improved thermo-oxidative stability and enhanced processability are prepared by the reaction of a mixture of monomers comprising a non-planar polyphenyl diamine (a), a diester of tetracarboxylic acid or the corresponding dianhydride (b) and an end-capping agent (c), or a diamine (d), a non-planar polyphenyl diester or dianhydride of a tetracarboxylic acid (e) and an end-capping agent (c).
Chuang, Chun-Hua. (1994). Addition polyimides with enhanced processability (U.S. Patent No. 5322924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5322924
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile