The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 1994

Filed:

Mar. 02, 1993
Applicant:
Inventors:

Hirohide Hamazaki, Ichihara, JP;

Akira Fujiwara, Ichihara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; B32B / ; C08F / ;
U.S. Cl.
CPC ...
525445 ; 428458 ; 428480 ; 428483 ;
Abstract

Disclosed is a resin composition comprising 20 to 90 parts by weight of an ethylene/(meth)acrylic ester/carbon monoxide terpolymer having been graft modified with an unsaturated carboxylic acid or its anhydride and 80 to 10 parts by weight of a polyester elastomer having been graft modified with the above modifier, the total amount of said graft modified ethylene/(meth)acrylate/carbon monoxide terpolymer and polyester elastomer being 100 parts by weight. Also disclosed is an adhesive comprising the above-mentioned resin composition. The resin composition and the adhesive according to the invention are excellent in adhesion properties, heat resistant adhesive properties, hue and heat stability.


Find Patent Forward Citations

Hamazaki, Hirohide. (1994). Resin composition and adhesive using the same (U.S. Patent No. 5322908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5322908

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…