The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 1994

Filed:

Aug. 09, 1991
Applicant:
Inventors:

Yoshikazu Sakai, Ibaraki, JP;

Kiyoshi Inoue, Ibaraki, JP;

Hiroshi Maeda, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F / ; C22F / ;
U.S. Cl.
CPC ...
148538 ; 148680 ; 148684 ;
Abstract

The present invention provides a new copper alloy containing silver from 4 to 32 at. %, which is useful for a magnet conductor, an IC lead frame, etc., having simultaneously a high strength and a high conductivity, manufactured by blending from 4 to 32 at. % silver into copper, casting, rapidly cooling and cold-working wherein the cold-working step includes a hot working treatment at a reduction rate of 40% to 70% at temperatures of from 300.degree. to 500.degree. C.


Find Patent Forward Citations

Sakai, Yoshikazu. (1994). Method of manufacturing a high strength, high conductivity copper-silver (U.S. Patent No. 5322574). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5322574

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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