The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 1994

Filed:

Apr. 23, 1993
Applicant:
Inventors:

Shuichiro Kato, Osaka, JP;

Masao Kinoshita, Osaka, JP;

Hiroshi Ikami, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
2281101 ; 228208 ; 228262 ; 228254 ;
Abstract

A joining method of an aluminum member to a dissimilar metal member excluding copper by brazing or soldering through the use of a brazing filler metal or a solder for aluminum member; in which a plating composed of a metal voluntarily selected from copper, aluminum, zinc, lead, silicon, cadmium, tin and an alloy having major component of two or more kinds of them, is previously applied on a surface of joined portion of the dissimilar metal member, the plated joined portion of the dissimilar metal member is dipped in a molten brazing filler metal or a molten solder and ultrasonic vibration is given to the joined portion to stick the brazing filler metal or the solder to the joined portion, and a brazing or a soldering is carried out thereafter.


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