The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 1994
Filed:
Sep. 13, 1991
Applicant:
Inventor:
Isami Sakai, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257211 ; 257208 ; 257758 ;
Abstract
A composite semiconductor integrated circuit device includes logic circuit blocks of a master slice system and function blocks such as memories all of which are integrated on a single semiconductor chip. The function blocks are constituted with n lower metal wiring layers. On a portion of a surface of the chip which overlaps with the function block, a (n+1)th metal layer is not provided as signal wiring, but a (n+2)th metal wiring layer or higher layers are provided. The step coverage of the metal wiring layers provided on the chip surface portion overlapping with the function block is improved and cross-talk between signal lines can be reduced.