The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 1994

Filed:

Dec. 11, 1992
Applicant:
Inventors:

Mir A Ali, Lomita, CA (US);

Clark A Saito, Cerritos, CA (US);

Assignee:

Hughes Aircraft Company, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M / ;
U.S. Cl.
CPC ...
429104 ; 429193 ; 429185 ;
Abstract

An electrochemical storage cell (20) includes a ceramic housing frame (22) with a flat plate solid ceramic electrolyte (32) bonded to a internal shoulder (26) of the housing frame (22) with a glassy seal (33). A metallic weld ring (34) is bonded to each end of the housing frame (22). Each weld ring (34) has a welding flange (36) disposed parallel to a respective end of the housing frame (22) and also has a bonding flange (40). The bonding flange (40) lies parallel and adjacent to an internal surface (24) of the housing frame (22) if the coefficient of thermal expansion of the weld ring (34) is less than that of the housing frame (22), and parallel and adjacent to an external surface (28) of the housing frame (22) if the coefficient of thermal expansion of the weld ring (34) is greater than that of the housing frame (22). A glassy seal (42) is formed between the bonding flange (40) of each weld ring (34) and the respective adjacent surface (24 or 28) of the housing frame (22). The glassy seals (33 and 42) are formed by heating an assembly of the components to the glass transition temperature of the glassy seal material to effect bonding and then slowly cooling to minimize thermal stresses.


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