The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 1994

Filed:

Jul. 01, 1991
Applicant:
Inventors:

Gary Long, Cincinnati, OH (US);

Arnold H Deutchman, Columbus, OH (US);

Assignee:

Laser Centers of America, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N / ;
U.S. Cl.
CPC ...
606 28 ; 606-2 ; 606 16 ;
Abstract

A laser light energy powered device for providing directed emission of laser light energy has a blunt, i.e., non-sharp, laser light emitting tip element. The tip element is preferably formed as a slab defined by two pairs of parallel sides, a proximal end face for receiving laser light energy conveyed thereto through an optic fiber, and a laser light energy emitting curved-sided distal end surface. The curved side surface is contiguous at one end with one of the elongate parallel sides defining the tip element. All surfaces are smooth and polished in one embodiment and laser light energy is emitted therefrom in a first portion focused generally forwardly of the distal end of the tip element and in a second portion emitted laterally of the end portion of the tip element. In other aspects of the invention, the distal end surface portions of the tip element are provided with a smooth thin layer of a high temperature melting point material ballistically bonded to the tip element material by an ion beam mixing process or an ion beam enhanced deposition process with sufficient energy to form a secure metallic-ceramic bond with the material of the tip element. This securely bonded layer totally absorbs all laser light energy reaching it through the tip element material and converts it into heat applicable by contact with tissue for surgical purposes.


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