The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 1994
Filed:
Jul. 13, 1993
Kazumi Uratsuji, Tokyo, JP;
Noriyuki Matsuoka, Yokohama, JP;
Yamaichi Electric Co., Ltd., Tokyo, JP;
Abstract
A connector for a leadless IC package having contacts to be pressure contacted with conductive pads arranged on a lower surface of a leadless IC, wherein each of the contacts is formed of a spring element, the connector including a contact holding portion in which the spring element is implanted, a contact braking portion disposed above the contact holding portion, and a contact operating portion laterally movably disposed between the contact braking portion and the contact holding portion, the spring element extending through a contact operating through-hole formed in the operating portion, a distal end of the spring element being received in a contact braking through-hole formed in the braking portion, the spring element being sidewardly pressurized by an inner wall of the contact operating through-hole when the operating portion is moved in one direction, so that the spring element is bent and displaced, the spring element being restored to its original state when the operating portion is laterally moved in the other direction, the distal end portion of the spring element being extended and retracted while it is braked by the inner wall of the contact braking through-hole by the bending displacement and restoration, the distal end portion of the spring element being pressure contacted the conductive pad of the IC when the spring element is expanded.