The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1994
Filed:
Dec. 15, 1992
Applicant:
Inventors:
Kouichi Watanabe, Tokyo, JP;
Isao Furuhashi, Tokyo, JP;
Assignees:
Sony Corporation, Tokyo, JP;
YKC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174262 ; 174264 ; 174266 ;
Abstract
A double-sided printed wiring board includes a base plate having a copper foil laminated on each of the opposite sides thereof. The copper foil-laminated base plate has through-holes extending therethrough, and at least one of the through-holes is internally plated for providing a through-via-hole into which a resin filler is provided and solidified. A closed through-via-hole is thus obtained. The copper foil-laminated base plate including the closed through-via-hole is copper-plated, and a particular wiring pattern is formed thereon. A chip land is formed in alignment with the closed through-via-hole.