The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 1994

Filed:

Feb. 25, 1993
Applicant:
Inventors:

Jun Saito, Chiba, JP;

Toshimori Nakai, Chiba, JP;

Sinzi Chiku, Chiba, JP;

Takanobu Kawamura, Chiba, JP;

Kazuo Ito, Aichi, JP;

Yoshiro Umemoto, Aichi, JP;

Assignee:

Chisso Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J / ;
U.S. Cl.
CPC ...
524504 ; 524505 ;
Abstract

An emulsion adhesive composition is provided which comprises: (i) an aqueous elmusion of a adhesive synthetic resin and (ii) a solution of an organic solvent and a polyolefin and/or a hydrogenated block copolymer composed of an aromatic vinyl compound and an aliphatic diene polymer blocks, and each of the polyolefin and the hydrogenated block copolymer contains at least one functional group selected from carboxylic anhydride carboxyl, glycidyl, hydroxyl, amido and alkoxysilyl groups. A photostabilizer may be incorporated into the composition in which said component (ii) may contain chloro. The emulsion adhesive composition can be used for adhering a highly crystalline resin molded article to an optional material without a complicated surface treatment, and can have a light resistance and storing stability.


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Saito, Jun. (1994). Emulsion adhesive composition and process for production thereof (U.S. Patent No. 5319016). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5319016

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