The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1994
Filed:
Jan. 29, 1993
Applicant:
Inventors:
Yasuyuki Tanaka, Tsuchiura, JP;
Chikafumi Oomachi, Kashiwa, JP;
Assignee:
Nippon Mektron, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29830 ; 29852 ; 156902 ; 2281801 ; 427 97 ;
Abstract
A method for the manufacture of a multilayer printed circuit board on which integrated circuit chips may be directly mounted includes producing holes at predetermined locations to enable electrical connections between a chip and conductive layers of the circuit board to be established via the holes. Electrically conductive bump members, which protrude outwardly from the circuit board, are formed in registration with the holes. The bump members cooperate with an electrically conductive plating layer or filler that is deposited so as to be in intimate contact with a conductive layer(s) exposed during the production of each hole.