The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 1994
Filed:
Apr. 30, 1990
Sue E Crank, Coppell, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An improved metallized structure (10) is formed from a copper seed layer (46) and a copper structure (48). Semiconductor devices to be connected (16-18) are covered by a conductive barrier layer (20). An oxide layer (28) is then deposited over the barrier layer (20) and patterned using standard photolithographic techniques and an anisotropic plasma etch. Vertical sidewalls (36-38) are formed by the etch and an HF deglaze. A seed layer (44-46) is then sputtered onto a photoresist layer (30) and the exposed barrier layer (20). After stripping the photoresist (30) and the seed layer (44) thereon, the copper structure (48) is electroplated over the remaining seed layer (46). The structure (48) thus formed has approximately vertical sidewalls (24-26) for improved contact with subsequent layers.