The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 1994

Filed:

Dec. 11, 1992
Applicant:
Inventors:

Jae I Ko, Changwon, KR;

Jae W Lee, Changwon, KR;

Yoon M Lee, Changwon, KR;

En J Jean, Changwon, KR;

Chun K Kim, Changwon, KR;

Jin Kim, Changwon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264 51 ; 264101 ; 264152 ; 264257 ; 264263 ; 264321 ; 156172 ;
Abstract

A manufacturing method is provided from manufacturing a dipper stick having a box shaped structure including an outer casing member formed of a high strength polymeric composite materials, an inner filler comprising polyurethane foam and disposed inside the outer casing member in order to be integrated with the outer casing member, and a plurality of bushing holders made of polymeric composite material and disposed at respective connecting portions of the box shaped structure in order to be integrated with the box shaped structure. The dipper stick is configured to be connected at the respective connecting portions to a bucket, a boom, dipper and bucket cylinders and a link, respectively. The manufacturing method includes the steps of: forming each bushing holder by a filament winding process and forming the inner filler of polyurethane foam; assembling each bushing holder with the inner filler in order to provide a first assembly; arranging the first assembly in a cavity of a mold of a resin transfer molding system; and then forming the box shaped structure by a resin transfer molding process in which liquid polymeric material is transferred to the mold and a curing treatment is carried out.


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