The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 1994
Filed:
Oct. 15, 1992
Akira Tanaka, Hitachi, JP;
Hiroichi Shinohara, Hitachi, JP;
Kazuji Yamada, Hitachi, JP;
Takao Ohba, Hadano, JP;
Akira Yamagiwa, Hadano, JP;
Hitoshi Yoshidome, Hadano, JP;
Yuji Shirai, Kodaira, JP;
Toshio Hatada, Tsuchiura, JP;
Munehisa Kishimoto, Kamakura, JP;
Michiharu Honda, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.