High-speed non-destructive cleaning of metal foam substrate of

Abstract

A localized surface area of an open foam type metal substrate of an electrochemical cell electrode, where the substrate is filled with active material and compressed, is subjected to light pressure scrubbing by a heated soldering iron tip subjected to ultrasonic vibration to quickly dislodge the active material network of the open foam type metal substrate. Compressed air at approximately 100 psi is blown through the open foam type metal substrate to remove dislodged active material particles from the foam type metal substrate to permit effective welding of a metal terminal connection to the substrate at the localized area after cleaning. Alternatively, both opposite surfaces of the open foam type metal substrate at the localized area may be brushed to initially dislodge the active material from the pores of the open foam type metal substrate and the dislodged particles blown through the substrate from one surface to the other. Preferably, suction is applied to the opposite surface of the substrate from that subjected to the compressed air blowing to facilitate the removal of dislodged particles of active material.