The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 1994

Filed:

Apr. 08, 1993
Applicant:
Inventors:

John J Tumpey, Oakhurst, NJ (US);

Raymond W Borden, Farmingdale, NJ (US);

Robert C Eckenfelder, Point Pleasant, NJ (US);

Sampat S Shekhawat, Tinton Falls, NJ (US);

Assignee:

AlliedSignal Inc., Morris Township, Morris County, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257712 ; 257714 ; 174 163 ;
Abstract

A two-sided hermetically sealed package of a metal matrix composite material includes a heat sink and integral cooling fins on each of the two sides which are totally enclosed to retain cooling fluid. Power semiconductors are mounted on ceramic substrates having metallic conductors mounted on both sides thereof. The substrates are mounted to the heat sinks. Cooling is provided by the passage of cooling fluid into one end of the enclosed fins, over the fins and out the other end. The metal matrix composite material and the ceramic are thermally matched and the package is provided with a minimum number of thermal interfaces.


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