The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 1994
Filed:
Aug. 02, 1993
David A Tribbey, Boynton Beach, FL (US);
Henry F Liebman, Tamarac, FL (US);
Allen D Hertz, Boca Raton, FL (US);
Peter E Albertson, Cooper City, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).