The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 1994
Filed:
Dec. 02, 1991
Craig Fullerton, Chandler, AZ (US);
Douglas J Mathews, Mesa, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An RF test equipment and wire bond interface circuit (150) for facilitating the on-wafer (100) testing of integrated circuits (120) has an electrical interface (102,104,106), for providing electrical coupling to the IC (120) and a low-pass filter structure connected between the electric interface (102,104,106) and the IC (120). The low-pass filter structure comprises a first inductive element (108) connected in series with the electrical interface (102,104,106) for simulating wire bond reactances, a second inductive element (114) connected in series with the first inductive element (108) for making contact with the IC (120) and at least one capacitor (110,112) connected between ground and a point common to both the first (108) and the second (114) inductive elements, for providing shunt capacitance and defining a Tee type low-pass matched filter at the input (121) and the output (123) of the IC (120). The RF test equipment and wire bond interface (150) assure the on-wafer performance of the IC (120) will correspond to its off-wafer performance, despite the addition of wire bonds (127,129 and 133,135).