The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 1994

Filed:

Aug. 06, 1992
Applicant:
Inventors:

Hideshi Nomura, Otsu, JP;

Masuichi Eguchi, Kyoto, JP;

Masaya Asano, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528353 ; 528125 ; 528126 ; 528128 ; 528172 ; 528173 ; 528179 ; 528188 ; 528192 ; 528220 ; 528229 ; 528350 ; 528351 ; 528392 ; 522 63 ; 522 65 ; 522 78 ; 524600 ; 430270 ;
Abstract

A photosensitive polyimide precursor composition containing as main ingredients a poly(amic acid) wherein at least one molecular end is esterified with an alcohol, a compound containing carbon-carbon unsaturation having photoreactivity, and a photopolymerization initiator. The photosensitive polyimide precursor composition of the present invention can be prepared without the formation of any harmful by-product. When film formed from this composition is masked for patterning and then subjected to exposure and development using a developer, the amount of exposed portion dissolved in the developer until unexposed portion is dissolved off by the developer, is small and so it is possible to obtain a thick pattern. Further, by heat-treating this pattern, there can be obtained a thick polyimide pattern.


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