The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 1994
Filed:
Sep. 02, 1992
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor device with air-bridge interconnection comprises: a substrate; a plurality of mesas with distance therebetween smaller than a predetermined value; and a metal layer supported by the plurality of mesas, the metal layer having a narrow portion at the intermediate portion thereof and both ends having larger width than the narrow portion. The air-bridge interconnection is obtained by side-etching controlled during dry-etching using interconnection metal layer as an etching-mask to remove a mass of semiconductor material under the interconnection metal layer. A method of producing the semiconductor device comprises the steps of forming a semiconductor material; forming a metal layer on a portion of the semiconductor material having a narrow portion in the intermediate portion thereof; and forming the air-bridge interconnection by dry-etching with side-etching controlled to form a groove having a predetermined depth; then forming a resistive layer on the bottom of the layer; and then dry-etching the semiconductor material and the metal layers again to remove a mass of the semiconductor material under the metal layer.