The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 1994
Filed:
Dec. 21, 1992
James K Heckman, Tempe, AZ (US);
Mark C Hoggatt, Mesa, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Bond tool pressure distribution is optimized by a method and apparatus having a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position. A first bonding arrangement is positioned on the first surface of the device. A second surface makes contact to the first bonding arrangement. This contact is detected and the device is unlocked to allow the first surface to incline while the second surface is in contact with the first bonding arrangement. The second surface is applied to the first bonding arrangement with a force, and the device is locked upon application of the force.