The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
Nov. 02, 1992
Applicant:
Inventors:
Haruo Tanaka, Kyoto, JP;
Naofumi Aoki, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S / ;
U.S. Cl.
CPC ...
372 50 ; 372109 ; 385 92 ;
Abstract
A mold-type semiconductor laser device comprises a metallic support plate, a semiconductor laser chip carried by the support plate, a resinous molded body for sealing the laser chip; and a transparent plate attached to the molded body in opposed relation to a front cleavage face of the laser chip. The support plate has a positioning face which is substantially parallel to the front cleavage face of the laser chip and comes into direct contact with the transparent plate.