The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
Dec. 22, 1992
Applicant:
Inventors:
Hisayoshi Fujikawa, Aichi, JP;
Koji Noda, Aichi, JP;
Takeshi Ohwaki, Aichi, JP;
Yasunori Taga, Aichi, JP;
Assignee:
Kabushiki Kaisha Toyota Chuo Kenkyusho, Aichi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257750 ; 257751 ; 257754 ; 257741 ; 252521 ; 252509 ; 252513 ; 252519 ;
Abstract
An electrode assembly for a semiconductor device includes a contact layer formed on a semiconductor substrate and consisting mainly of a rare-earth metal or metals, or a silicide thereof, or a mixture thereof, and a diffusion barrier layer formed on the contact layer and consisting mainly of iron or an iron alloy. The assembly is bonded to a mount by a solder layer formed on the diffusion barrier layer and consisting mainly of lead and tin.