The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
May. 29, 1992
Hiromi Ito, Amagasaki, JP;
Ichiro Takahashi, Amagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile