The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
May. 15, 1992
Applicant:
Inventor:
Seiichi Sakura, Suwa, JP;
Assignee:
Seiko Epson Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437183 ;
Abstract
A bump electrode of an inexpensive and reliable semiconductor device is provided in which a remaining metal wire portion produced during bump electrode formation is eliminated. The remaining metal wire portion made in a bump electrode forming method for a semiconductor device using a wire bonding technique is pressed and reshaped from above with heat or ultrasonic waves so as to apply pressure and heat to the bump electrode by using a stamping tool.
Sakura, Seiichi. (1994). Semiconductor device, method of forming bump electrode of a (U.S. Patent No. 5306664). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5306664
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