The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1994
Filed:
May. 27, 1993
Yoshio Yoshikawa, Tokyo, JP;
Yoshiaki Inoue, Tokyo, JP;
Teruo Takeuchi, Tokyo, JP;
Kazuo Fujinami, Tokyo, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.