The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 1994

Filed:

Apr. 23, 1992
Applicant:
Inventors:

Kiyohiro Furutani, Hyogo, JP;

Michihiro Yamada, Hyogo, JP;

Shigeru Mori, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C / ;
U.S. Cl.
CPC ...
36518901 ; 365200 ; 365207 ;
Abstract

A sense.multidot.input/output gate includes MOS transistors which are provided for each bit line pair and have their gates and drains cross-coupled together, separating transistors arranged between the gates and the drains of the MOS transistors, and column selecting gates connecting the drains of the MOS transistors to internal data transmitting lines. The semiconductor memory device further includes a load circuit which precharges the internal data transmitting lines to a predetermined potential in a test mode, and a line test circuit which determines existence and nonexistence of a defective memory cell based on the potentials of the internal data transmitting lines. In the data reading operation, the column selecting gates become conductive while the separating transistors are in OFF state, and the potential of the internal data transmitting line changes by virtue of the discharge through one of the cross-coupled MOS transistors. In this construction, the sense amplifier is used also as the read gate. Therefore, high-speed reading of data is allowed, and tests for many memory cells in up to one row can be simultaneously performed. Accordingly, a test time is reduced in a highly integrated semiconductor memory device.


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