The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 1994
Filed:
Dec. 17, 1991
Hiroyuki Umetani, Iwakuni, JP;
Takeyoshi Yamada, Iwakuni, JP;
Teijin Limited, Osaka, JP;
Abstract
A plural liquid pack type heat curable resin compound useful for producing a shaped resin article having an enhanced resistance to heat and chemicals, and excellent mechanical and electrical properties, comprises a first individual liquid component (A) comprising a polyisocyanate compound (a) and a second individual liquid component (B) comprising a glycidyl acrylate compound (b) having ##STR1## groups in which R' and R' respectively and independently represent a --H or --CH.sub.3, a cyclization catalyst (c) and optionally at least one of polyol compounds (e) and polyepoxy compounds (f), the first and/or second individual liquid components (A) and/or (B) comprising a radical curing catalyst (d).