The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1994
Filed:
Jun. 08, 1993
Applicant:
Inventors:
Harold Umansky, Plainfield, NJ (US);
Robert J Coakley, Cranford, NJ (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D04H / ;
U.S. Cl.
CPC ...
264109 ;
Abstract
A method for applying release agent to wood material and binder used in the manufacture of chipboard. An aqueous solution of the release agent is foamed to form a coherent foam blanket that is applied to the wood material and binder. The foam leaves a coating of release agent on the wood material and binder that enhances release of a platen from the same. Foaming the release agent avoids deleterious aerosolization and increases the efficiency of applying the release agent.
Umansky, Harold. (1994). Method for the manufacture of waferboard (U.S. Patent No. 5302330). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5302330
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile