The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 1994

Filed:

Jun. 15, 1992
Applicant:
Inventors:

Takeshi Miura, Oomiya, JP;

Masaru Seita, Ina, JP;

Shigeru Kodaira, Kiyose, JP;

Assignee:

LeaRonal Japan Inc., Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
205 85 ; 427437 ; 4274431 ; 106-127 ; 106-122 ;
Abstract

An immersion tin/lead alloy plating bath has a basic composition comprising an organic sulfonic acid, divalent tin and lead salts of the organic sulfonic acid and thiourea and further contains thiocyanic acid or derivative thereof, optionally with hydrated hydrazine. With this plating bath, an alloy deposit, which has a particularly desired Sn/Pb ratio of 60%/40% or so and is improved in terms of adhesion and homogeneity, can be stably obtained on the surface of copper or a copper alloy in a relatively low temperature region within a short span of time.


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