The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 1994
Filed:
Aug. 14, 1989
Applicant:
Inventors:
Marie Angelopoulos, Briarcliff Manor, NY (US);
Wu-Song Huang, Poughkeepsie, NY (US);
Jae M Park, Binghamton, NY (US);
James R White, Owego, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C23C / ;
U.S. Cl.
CPC ...
205 50 ; 205125 ; 205164 ;
Abstract
A process for fabricating a printed circuit board concerns the use of a soluble, air-stable conducting polymer applied to plated through holes, blind holes or vias or to a predetermined portion of the printed circuit board surface for selectively metal plating on the polymer without the necessity of either an electroless plating bath or the use of precious metal seeds. A preferred conducting polymer is polyaniline. A preferred metal plating is preferably copper or a noble metal such as palladium or silver.