The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 1994
Filed:
Jul. 14, 1992
Shiro Ohtaki, Yokohama, JP;
Asahi Glass Company Ltd., Tokyo, JP;
Abstract
A process for fabricating a multilayer ceramic circuit board which includes the steps of (i) providing a sintered ceramic substrate having optionally formed via holes already filled with a conductive paste or a conductive substance, (ii) optionally applying an insulating paste layer in a prescribed pattern on one side or each side of the ceramic substrate, (iii) then, providing a ceramic green tape and forming via holes in the green tape, (iv) applying a conductive paste to form a conductive pattern on one side of the green tape, (v) laminating the green tape to one side or each side of the ceramic substrate so that the conductive pattern of the green tape faces the substrate, (vi) optionally pressing and heating the laminate from step (v), and (vii) applying a conductive paste to form a conductive pattern on the other side of the green tape and filling the via holes of the green tape with a conductive paste, before or after step (v).