The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 1994
Filed:
Jun. 12, 1992
Karl-Erik Leeb, Djurhamn, SE;
Telefonaktiebolaget L M Ericsson, Stockholm, SE;
Abstract
A circuit board with a lateral conductive pattern and shielded regions comprises a first contour cut laminate of a substrate having a conductive pattern of signal conductors and ground conductors on one side and a copper foil on the other side, covering the entire side. This laminate is laminated with the side provided with the conductive pattern to a second laminate also comprising a contour cut substrate and a copper foil provided on the substrate on the side opposite to the first laminate. Windows are cut in the substrate of the second laminate and are etched away in the top copper foil to enable mounting of components to the conductive pattern in the windows. A metal layer is provided to electrically connect said foil covering the entire other side of the first laminate with the ground conductors of the conductive pattern and the foil of the second laminate. In a method of manufacturing such a circuit board a first laminate of a substrate, covered on one side by a copper foil, is contour cut whereafter a second entirely covering copper foil is laminated to the second side of the substrate, and a conductive pattern of signal conductors and ground conductors is etched in the second copper foil. The second substrate is also contour cut and is laminated to a copper foil, whereafter a window is etched in the copper foil, corresponding to the window cut in the substrate. The second laminate thus formed is adjusted in regard of the pattern to the first laminate and is adhesively secured thereto, the side of the second laminate covered by the copper foil turned away from the side of the first laminate provided with the conductive pattern. A metal layer is thereafter applied to the surface of the first laminate facing away from the side having the conductive pattern and the lateral edges to electrically connect said surface, the ground conductors of the conductive pattern and the foil on the second substrate, whereafter components are mounted in the windows in the second laminate to the conductive pattern.