The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 1994

Filed:

Nov. 13, 1992
Applicant:
Inventor:

Tokumi Hayashi, Yamatokoriyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 96 ; 427261 ; 427265 ; 427370 ; 4274125 ;
Abstract

A hot melt agent is printed between terminals of a heat seal film substrate 1 having a circuit printed of conductive material on a base film such as polyester. An anisotropic film mixing nickel particles is printed on the terminals. Afterwards, a hot melt agent is printed on the upper surface, and thermo-compression bonded to the printed wiring board on the opposite side. Hence, deviation of terminals is prevented at the time of connection of heat seal film substrate connected by thermo-compression bonding, while elongation of base film is prevented, so that terminals may be connected accurately, so as to be applicable to fine pitches.


Find Patent Forward Citations

Hayashi, Tokumi. (1994). Method for connecting terminals of heat seal film substrate (U.S. Patent No. 5298279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5298279

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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