The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 1994
Filed:
Sep. 22, 1992
Teruo Kusaka, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a packaging method for a flip-chip type semiconductor device, the method in which the rear surface sides of a plurality of semiconductor chips having solder bump electrodes on their front surfaces are fixed temporarily with an adhesive to the respective predetermined locations on the flat surface of a block, the block and a circuit board are positioned by placing the flat surface of the block opposed to the front surface of the circuit board where pads are formed, the solder bump electrodes and the pads are brought into contact by bringing them close to each other without the intermediary of soldering flux, and the plurality of semiconductor chips are bonded in a lump to the circuit board by welding the solder bump electrodes to the pads through reflowing of the solder of the solder bump electrodes by subjecting them to heat treatment.