The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 1994
Filed:
Mar. 25, 1991
Kenichi Shirai, Yokohama, JP;
Satoshi Shibahara, Tokyo, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor device having a moisture barrier comprises a semiconductor substrate, a plurality of bonding pads arranged along at least one side of the semiconductor substrate, and an insulating film provided between at least one side of the semiconductor substrate and the bonding pads opposite to that side, and provided with means for preventing incursion of moisture, thereby to prevent moisture from being absorbed from the chip side surface. Further, there is also disclosed a method of manufacturing such a semiconductor device, which comprises the steps of forming an insulating film on a semiconductor wafer, forming a plurality of bonding pads arranged along dicing lines of the semiconductor wafer, and forming a contact hole or a via hole in the insulating film, and forming at the same time, a groove structure so that it is arranged between the dicing lines and the plurality of bonding pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile