The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 1994
Filed:
Dec. 21, 1992
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor assembly which includes a carrier and a semiconductor die is mounted on a printed wiring board. The die includes a top active surface and a bottom active surface. The two active surfaces are non-coplanar. The carrier is made from layers of a ceramic material. Holes are formed through all but one of the layers. The layers are laminated into an integral substrate, and the substrate is fired. The holes form a cavity into but not through the substrate. The number of layers, lamination pressures, and firing parameters are all adjusted in response to the thickness of the die to insure that the height of cavity walls approximately equals the thickness of the die. Continuous metallization is applied in the cavity and on a top surface of the substrate. The die is bonded in the cavity, and conductive bumps are formed on the die and the metallization.