The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 1994

Filed:

Jun. 19, 1992
Applicant:
Inventors:

Hiroji Tani, Kyoto, JP;

Teppei Kubota, Kyoto, JP;

Tohru Kasanami, Kyoto, JP;

Kazuto Miyagawa, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C / ; H01C / ;
U.S. Cl.
CPC ...
338306 ; 338 25 ; 338313 ; 338332 ;
Abstract

A platinum temperature sensor includes a meandering pattern portion and outlet portions continuously connected to respective ends thereof which are defined by a platinum film which is formed on an insulating substrate. External electrodes are formed to cover the outlet portions as well as the ends of the insulating substrate provided with the outlet portions. Each of the external electrodes comprises a first layer containing platinum or nickel which is in contact with the outlet portion and with the insulating substrate, a second layer containing silver and platinum which is formed on the first layer, a third layer containing nickel which is formed on the second layer, and a fourth layer containing tin or solder which is formed on the third layer. The first layer suppresses diffusion of silver contained in the second layer, and the third layer improves heat resistance of the second layer, while the fourth layer improves solderability.


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