The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 1994

Filed:

Feb. 19, 1993
Applicant:
Inventors:

Kiici Mori, Hiratsuka, JP;

Kiyotake Fukawa, Hiratsuka, JP;

Tsutomu Maruyama, Hiratsuka, JP;

Assignee:

Kansai Paint Co., Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F / ; C23F / ;
U.S. Cl.
CPC ...
430313 ; 430318 ; 430327 ; 106 1405 ; 106 1416 ; 106 1418 ; 106 1437 ; 252390 ; 252394 ;
Abstract

A process for preparing a printed circuit board. The process involves successive steps of coating a photosensitive electrodeposition coating composition onto a printed-circuit copper-clad, laminated base plate to form a photosensitive resist film, applying a pattern mask onto the photosensitive resist film, exposing to an active light, developing and etching. Also the printed-circuit copper-clad, laminated base plate is subjected to a corrosion preventing treatment after cladding or laminating and prior to the step of coating the electrodeposition coating composition thereonto with a nitrogen-containing heterocyclic compound as a corrosion inhibitor.


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