The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 1994

Filed:

Jun. 25, 1993
Applicant:
Inventors:

Akira Mizuta, Kanagawa, JP;

Masazumi Ogawa, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q / ; B65G / ; B28B / ;
U.S. Cl.
CPC ...
29559 ; 29806 ; 1983451 ; 264156 ; 269305 ;
Abstract

Positions of a tail end of a molded synthetic resin material, which is conveyed precedently, and a leading end of a molded synthetic resin material, which is conveyed following the molded synthetic resin material which is conveyed precedently, are adjusted simultaneously with respect to two reference surfaces, which are close to each other and are spaced a predetermined distance apart from each other. A process is carried out simultaneously on or parts are simultaneously associated with both a portion in the vicinity of the tail end of the molded synthetic resin material, which is conveyed precedently, and a portion in the vicinity of the leading end of the molded synthetic resin material, which is conveyed following the molded synthetic resin material which is conveyed precedently, while the positions of the tail end and the leading end are kept in the adjusted states. Regardless of fluctuations in dimensions of molded synthetic resin materials, the process or parts association is carried out accurately such that the working efficiency may be kept high.


Find Patent Forward Citations

Loading…