The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 1994

Filed:

Apr. 09, 1993
Applicant:
Inventor:

Alan R Cherrette, Plainsboro, NJ (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q / ; H01Q / ;
U.S. Cl.
CPC ...
3437 / ; 343853 ; 343D / ;
Abstract

According to the present invention, a thin, lightweight active phased array antenna panel is provided that efficiently radiates heat and arbitrarily polarized microwave signal power. The active array panel also efficiently reflects solar power so as to minimize solar heating. The active array panel includes a plurality of subarray elements each of which includes a plurality of aperture coupled patch radiators. The exterior surface of the subarray element is covered with silvered second surface mirrors to provide efficient radiation of heat in the presence of sunlight. A microstrip feed network in the subarray element is embedded in a dielectric material with a high thermal conductivity to efficiently distribute heat. The active array further includes an electronics module for each subarray element. The electronics module contains a solid state power amplifier, phase shifter and associated electronics mounted in a housing made of material with high thermal conductivity. Each electronics module and corresponding subarray element are thermally and electrically connected to each other and to a support structure assembly with silver-quartz mirrors bonded to the lower exterior surface. Heat generated by the circuits in the electronics module is conducted through the housing and transferred to the outer surfaces of the subarray element and support structure assemblies where it is radiated into space.


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