The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 1994
Filed:
Jun. 01, 1992
Applicant:
Inventors:
Richard Hsiao, Vestal, NY (US);
Jack M McCreary, Apalachin, NY (US);
Voya R Markovich, Endwell, NY (US);
Donald P Seraphim, Vestal, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437211 ; 437212 ; 437213 ;
Abstract
Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.
Quick Actions:
Hsiao, Richard. (1994). Solder interconnection structure on organic substrates and process for (U.S. Patent No. 5292688). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5292688
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile