The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 1994

Filed:

Jun. 24, 1991
Applicant:
Inventor:

Clive Scorey, Cheshire, CT (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F / ; B22F / ;
U.S. Cl.
CPC ...
419 20 ; 419 19 ; 419 23 ; 419 34 ; 419 35 ; 419 64 ; 419 69 ;
Abstract

The present invention relates to a copper-molybdenum composite material having utility in electrical applica- tions and the process for forming the composite material. The composite material is characterized by a continuous copper matrix having a plurality of discrete molybdenum particles embedded therein. The molybdenum particles have an aspect ratio in the range of from about 1:1 to about 4:1 so as to create a thermal path through the matrix from a first side of the composite material to a second side of the composite material. The resulting composite material exhibits improved through-thickness thermal conductivity as a result of the molybdenum particles being within the aforementioned range. The process for forming the composite material includes the steps of blending the molybdenum in powder form with powdered cuprous oxide, heating the blended powdered material to form copper-coated molybdenum particles, blending the copper-coated molybdenum particles with powdered copper and then roll compacting the blended materials to form the composite material. For certain compositions, i.e., those where the molybdenum content is greater than 80 wt. %, the second blending step may be omitted.


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