The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 1994

Filed:

Aug. 05, 1991
Applicant:
Inventors:

Bruce D Baker, Olivenhain, CA (US);

Robert L Corey, San Diego, CA (US);

John A Adams, Escondido, CA (US);

Edward W Ross, Escondido, CA (US);

Assignee:

Four Pi Systems Corporation, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
378 22 ; 378207 ; 378 62 ;
Abstract

A method and apparatus for the detection of excess or insufficient solder conditions at electrical connections on printed circuit boards are disclosed. The invention analyzes a cross-sectional image of an electrical connection to obtain the average solder thickness of the connection. This average solder thickness is then compared to an upper threshold value to determine if the connection is an excess solder defect, and a lower threshold value to determine if the connection is an insufficient solder defect. In one embodiment, the present invention compensates for variations in image intensity due to the background by employing a first and second correction factor in the calibration technique. The first correction factor is the measured background gray scale value local to the connection, while the second correction factor is determined to have a substantially linear relationship to the background image intensity local to each solder connection. The present invention further includes a process control feedback system which detects and compensates for trends in the solder application process. This helps to insure that defective solder joints are avoided before they are produced. In one embodiment, the process control feedback system is fully automated.


Find Patent Forward Citations

Loading…