The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 1994
Filed:
Sep. 23, 1992
Applicant:
Inventor:
Hideo Matsumoto, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361710 ; 361723 ; 257669 ; 257675 ;
Abstract
An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate.