The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 1994
Filed:
Apr. 16, 1992
Yasuhiro Kurokawa, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A packaged semiconductor device has a wiring substrate. A plurality of semiconductor device chips are connected to the wiring substrate by a use of bumps. A heat sink is bonded through a high heat conductive bonding layer to a surface of each of the semiconductor device chips. In addition, a package casing which accommodates the semiconductor device chips and the wiring substrate, has internal conductors which are positioned in the inside of the package casing. External connection pins extend outwardly from the package casing and are connected to corresponding internal conductors. The wiring substrate is connected to the internal conductors of the package casing via a flexible wiring circuit member. The flexibility of this wiring permits the thermal expansion and contraction to occur without breaking the connections to the bumps.