The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 1994
Filed:
Sep. 11, 1992
Applicant:
Inventors:
Masahiro Ishitsuka, Fukuoka, JP;
Kazuyuki Hayashi, Fukuoka, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257666 ; 257676 ; 257674 ;
Abstract
A semiconductor device has a lead, an inner lead of which is upwardly bent while an outer lead is downwardly bent. A junction part of the outer lead is guided from a resin block on a level which is lower than that of an upper major surface of the semiconductor chip. In fabrication of this semiconductor device, a guide frame of a lead frame, a suspending lead and a die pad held by the same are flush with each other.
Ishitsuka, Masahiro. (1994). Resin-molded semiconductor device and lead frame employed for (U.S. Patent No. 5291059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5291059
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile