The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 1994

Filed:

Jul. 10, 1991
Applicant:
Inventor:

Keiji Takeda, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430203 ; 430202 ; 430205 ;
Abstract

A light-sensitive material contains silver halide, a reducing agent and an ethylenically unsaturated polymerizable compound or/and a cross-linkable polymer. According to the present invention, the light-sensitive material comprises a support and at least three image forming functional layers. The layers include a light-sensitive layer, a polymerizable layer and an image formation accelerating layer. The light-sensitive layer contains silver halide. The polymerizable layer contains the ethylenically unsaturated polymerizable compound or/and the cross-linkable polymer. The image formation accelerating layer contains a component having a function of accelerating image formation. The component is selected from a reducing agent, a base, a base precursor and a heat development accelerator. The uppermost layer of the light-sensitive material preferably contains a polyvinyl alcohol having a saponification degree of not less than 70%. The light-sensitive material of the present invention is heat-developable. The present invention is based on a new discovery that a light-sensitive material comprising three or more image forming functional layers can be developed. An image forming method using the light-sensitive material is also disclosed.


Find Patent Forward Citations

Loading…